INSPECTION SOLUTIONS: YSi-X
Yamaha has invented the automated 3D X-ray and optical Hybrid Inspection System “YSi-X”. This is a multi-function 3D X-ray hybrid-type inspection system capable of complete in-line inspection of all facets of printed circuit boards. Thanks to a 3D X-ray inspection function through newly developed Yamaha-exclusive high-speed X-ray laminography imaging technology and multiple inspection functions utilizing optics and lasers, the YSi-X is achieving the highest level of 3D X-ray inspection speed in the industry at 3.3 sec/FOV and is lengthening the service life of the X-ray source and X-ray tubes.
Features of YSi-X
- Ideal for 100% 3D X-ray inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target
- Switchable tube voltage: 130 KV (onboard vehicle use), 110 KV (household use), 70 KV (device use)
- Select the type you need X-ray detector: type A (high resolution type), type B (long service life type), or type D (wide-angle high-speed type)
- X-ray, optical, infrared, and laser height measurement as standard test equipment; hybrid and high reliability with multiple inspection modes
Specifications
| Model | YSi-X | ||
|---|---|---|---|
| Applicable PCB | Size | L 560 × W 460 mm to L 100 × W 50 mm | |
| Mounted components | Upper edge 40 mm, lower edge 80 mm (40 mm during inline) | ||
| X-ray inspection | |||
| TYPE HD | TYPE HB | ||
| X-ray detector | FOS flat panel system High-speed type |
Direct conversion panel method Long service life type |
|
| Resolution | 7 to 54 µm | 18 to 54 µm | |
|
62 × 78 mm | 52 × 45 mm | |
|
4078.8 mm2/sec (resolution 27 µm） |
250.3 mm2/sec (resolution 54 µm） |
|
|
378.7 mm2/sec (resolution 19 µm） | 60.5 mm2/sec (resolution 27 µm） | |
|
218.4mm2/sec (resolution 19 µm） | 40.9mm2/sec (resolution 27 µm） | |
|
15.1 mm2/sec (resolution 19 µm） | 3.7 mm2/sec (resolution 27 µm） | |
| Method | 3D sliced images through digital laminography (planar CT) | ||
| Optical inspection | Inspection speed | 0.4 sec/field of view | |
| Resolution | 19 µm | ||
| Lighting | 3-step dome lighting, upper stage RGB & infrared, mid-stage RGB, lower stage RGB | ||
| Image capture system | Digital color camera, telecentric lens | ||
| Laser inspection | Resolution/Method | 5 µm (height direction)/Triangulation distance measurement by laser spot light | |
|
Less than 0.2 µSv/h | ||
|
L 1,720 × D 1,883 × H 1,705 mm (excluding protrusions)/Approx. 2,900 kg | ||
Specifications and appearance are subject to change without prior notice.